Description (eng)
The original data contains STEM MAADF images of graphene irradiated by low energy Ar ions, which resulted in a medium defect density. The datasets contain several hundred atomic resolution images that have been acquired using automated image acquisition.
Sample 1940:
Material: Graphene (Source: Graphenea Inc. Easy Transfer: Monolayer Graphene on Polymer Film)
Grid: custom SiN TEM chip produced by Silson (3x3 Array of 1 µm thick SiN Windows with circular perforations)
Electronic Lab Notebook sample ID: 1940
Treatment:
* Transferred onto SiN TEM grid using liquid Transfer method
* Insertion to UHV System via loadlock including bake
* Surface contamination removed inside UHV by cleaning laser
* Irradiated by low Energy Ar Plasma (3min)
* Removal of mobile contamination via laser heating
* Beamshower at -20k defocus for 20min
Name of data: map_2024_03_28_10_33
Acquisition date: 28.03.2024
Sample 1941:
Material: Graphene (Source: Graphenea Inc. Easy Transfer: Monolayer Graphene on Polymer Film)
Grid: custom SiN TEM chip produced by Silson (3x3 Array of 1 µm thick SiN Windows with circular perforations)
Electronic Lab Notebook sample ID: 1941
Treatment:
* Transferred onto SiN TEM grid using liquid Transfer method
* Insertion to UHV System via loadlock including bake
* Surface contamination removed inside UHV by cleaning laser
* Irradiated by low Energy Ar Plasma (7min)
* Removal of mobile contamination via laser heating
* Beamshower at -20k for 11min
Name of data:
* map_2024_03_28_17_46
* map_2024_03_29_12_25
* map_2024_03_29_14_37
Acquisition date: 28.03.2024 and 29.03.2024
Sample 1942:
Material: Graphene (Source: Graphenea Inc. Easy Transfer: Monolayer Graphene on Polymer Film)
Grid: custom SiN TEM chip produced by Silson (3x3 Array of 1 µm thick SiN Windows with circular perforations)
Electronic Lab Notebook sample ID: 1942
Treatment:
* Transferred onto SiN TEM grid using liquid Transfer method
* Insertion to UHV System via loadlock including bake
* Surface contamination removed inside UHV by cleaning laser
* Irradiated by low Energy Ar Plasma (10min)
* Beamshower at -30k for 20min
Name of data: map_2024_04_02_12_34
Acquisition date: 02.04.2024